Accuracy analyzing apparatus for machine tool

Details Accuracy analyzing apparatus for machine tool Accuracy analyzing apparatus for machine tool

2006-10-10

2006-10-10

Tran, Phuoc (Department: 2624)

Image analysis

Applications

Manufacturing or product inspection

C348S094000

Reexamination Certificate

active

07120288

ABSTRACT:
The present invention relates to an accuracy analyzing apparatus which is capable of efficiently analyzing accuracies of a machine tool including the perpendicularity of a spindle axis and the thermal displacement of a spindle with a higher level of accuracy at lower costs. The accuracy analyzing apparatus (1) comprises a laser oscillator (2) attached to the spindle (26) for emitting a laser beam having a light axis perpendicular to the spindle axis, an imaging device (5, 8) having a light receiving section (5) disposed in the vicinity of the laser oscillator (2) for receiving the laser beam from the laser oscillator (2) by the light receiving section (5) and generating two-dimensional image data, and an analyzer (15) for analyzing the accuracies of the machine tool (20) on the basis of the generated image data.

REFERENCES:
patent: 4018113 (1977-04-01), Blazenin et al.
patent: 5029097 (1991-07-01), Michigami et al.
patent: 5677768 (1997-10-01), Bockman
Patent Abstracts of Japan, Publication No. 04-082651, dated Mar. 16, 1992.
Patent Abstracts of Japan, Publication No. 10-138097, dated May 26, 1998.

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