Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Reexamination Certificate
2008-01-04
2009-02-10
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Smart card package
C257SE23064, C257SE23125, C257SE23061, C257SE23124, C257SE21504, C257S680000, C257S380000, C257S382000, C257S396000, C257S390000, C257S209000, C257S415000, C257S315000, C235S380000, C235S382000, C235S487000, C235S488000, C235S492000
Reexamination Certificate
active
07489027
ABSTRACT:
A storage apparatus10is disclosed, that comprises a wiring substrate11having a first surface and a second surface, a flat type external connection terminal12adisposed on the first surface of the wiring substrate11, a semiconductor device14disposed on the second surface of the wiring substrate11and having a connection terminal14aconnected to the flat type external connection terminal12a, a molding resin15for coating the semiconductor device14on the second surface of the wiring substrate11, a card type supporting frame10ahaving a concave portion or a hole portion fitting the wiring substrate11, the semiconductor device14, and the molding resin15in such a manner that the flat type external connection terminal12ais exposed to the first surface of the wiring substrate11, and adhesive resin a adhering integrally the flat type external connection terminal12a, the wiring substrate11, the semiconductor device14, the molding resin15, and the card type supporting frame10a. In addition, the storage apparatus10can be combined with a card type supporting means21that supports detachably with the flat type external connection terminal12aexposed to one of the surfaces so as to be used as a card type storage apparatus20having bigger size.
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Finnegan Henderson Farabow Garrett & Dunner L.L.P.
Kabushiki Kaisha Toshiba
Williams Alexander O
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