Etching a substrate: processes – Adhesive or autogenous bonding of two or more...
Patent
1996-12-05
1998-05-26
Powell, William
Etching a substrate: processes
Adhesive or autogenous bonding of two or more...
216 80, B44C 122
Patent
active
057559783
ABSTRACT:
Accelerometer and method in which parts such as the seismic mass and force sensors are all fabricated of a single material such as crystalline quartz and bonded together in a manner which reduces the possibility of creep between them. Damping plates and squeeze film gas damping dampen movement of the seismic mass, and the parts are oriented in a predetermined manner relative to the crystallographic axes of the wafers from which they are fabricated to control the character of breakaway tabs which hold the parts to the wafers during fabrication.
REFERENCES:
patent: 5415726 (1995-05-01), Staller et al.
Egley Bert D.
Lewallen Kenneth S.
Newell G. Richard
Orlosky Scott D.
BEI-Systron Donner
Powell William
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