Acceleration sensor chip package and method of producing the...

Details Acceleration sensor chip package and method of producing the... Acceleration sensor chip package and method of producing the...

2007-10-18

2009-11-10

Chapman, John E (Department: 2856)

Measuring and testing

Speed, velocity, or acceleration

Acceleration determination utilizing inertial element

C073S514010, C073S514380

Reexamination Certificate

active

07614301

ABSTRACT:
An acceleration sensor chip package includes an acceleration sensor chip formed of a frame portion with an opening portion, a movable structure, a detection element, and an electrode pad. The movable structure has a beam portion and a movable portion supported on the beam portion to be movable. The acceleration sensor chip package further includes a re-wiring layer with a wiring portion having one end connected to the electrode pad; an outer terminal connected to the other end of the wiring portion; a first sealing portion for sealing the electrode pad and the re-wiring layer; and a substrate for sealing the opening portion of the frame portion.

REFERENCES:
patent: 5490421 (1996-02-01), Ueyanagi
patent: 6263735 (2001-07-01), Nakatani et al.
patent: 6293149 (2001-09-01), Yoshida et al.
patent: 6316840 (2001-11-01), Otani
patent: 7267007 (2007-09-01), Nakamura
patent: 11-135804 (1999-05-01), None

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