Acceleration sensor chip package

Details Acceleration sensor chip package Acceleration sensor chip package

2007-11-27

2007-11-27

Chapman, John E. (Department: 2856)

Measuring and testing

Speed, velocity, or acceleration

Acceleration determination utilizing inertial element

C073S514010, C438S051000

Reexamination Certificate

active

11238014

ABSTRACT:
An acceleration sensor chip package includes an acceleration sensor chip formed of a frame portion with an opening portion, a movable structure, a detection element, and an electrode pad. The movable structure has a beam portion and a movable portion supported on the beam portion to be movable. The acceleration sensor chip package further includes a re-wiring layer with a wiring portion having one end connected to the electrode pad; an outer terminal connected to the other end of the wiring portion; a first sealing portion for sealing the electrode pad and the re-wiring layer; and a substrate for sealing the opening portion of the frame portion.

REFERENCES:
patent: 6263735 (2001-07-01), Nakatani et al.
patent: 6293149 (2001-09-01), Yoshida et al.
patent: 11-135804 (1999-05-01), None

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