Acceleration sensor assembly

Details Acceleration sensor assembly Acceleration sensor assembly

1992-01-27

1994-10-04

Williams, Hezron E.

Measuring and testing

Speed, velocity, or acceleration

Acceleration determination utilizing inertial element

73516R, 338 2, G01P 1509

Patent

active

053515420

ABSTRACT:
An acceleration sensor assembly is shown, which comprises a base board; a ceramic plate bonded to the base board, the ceramic plate having predetermined circuits printed thereon; an operational amplifier in the shape of Silicon-chip, the amplifier being mounted on the ceramic plate; an acceleration sensor proper mounted on the ceramic plate, the sensor proper being of a piezoresistance semiconductor type; a first group of bonding wires through which the operational amplifier and the circuits are connected; and a second group of bonding wires through which the acceleration sensor proper and the circuits are connected. In order to facilitate the bonding connection of the bonding wires to their associated parts, the bonding wires of the first and second groups are identical in diameter.

REFERENCES:
patent: 4430895 (1984-02-01), Colton
patent: 4829822 (1989-05-01), Imai et al.
patent: 4869107 (1989-09-01), Murakami
patent: 4967598 (1990-11-01), Wakatsuki et al.
patent: 5095751 (1992-03-01), Wada et al.

Affiliated with

Also associated with

Rating

Acceleration sensor assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Acceleration sensor assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Acceleration sensor assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-573869