Acceleration sensor and method of manufacturing acceleration...

Details Acceleration sensor and method of manufacturing acceleration... Acceleration sensor and method of manufacturing acceleration...

2006-07-04

2006-07-04

Williams, Hezron (Department: 2856)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C073S504130

Reexamination Certificate

active

07071549

ABSTRACT:
An acceleration sensor includes a semiconductor substrate, a sensing element formed on the semiconductor substrate, a bonding frame made of polysilicon which is formed on the semiconductor substrate and surrounds the sensing element, and a glass cap which is bonded to a top surface of the bonding frame made of polysilicon to cover the sensing element above the sensing element while being spaced by a predetermined distance from the sensing element. The bonding frame made of polysilicon is not doped with any impurity.

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patent: 5837562 (1998-11-01), Cho
patent: 6400009 (2002-06-01), Bishop et al.
patent: 6465854 (2002-10-01), Muenzel et al.
patent: 6762072 (2004-07-01), Lutz
patent: 6777259 (2004-08-01), Silverbrook
patent: 9-292409 (1997-11-01), None
patent: P2002-500961 (2002-01-01), None

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