Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2005-10-25
2005-10-25
Tsai, H. Jey (Department: 2812)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S704000, C257S710000, C438S051000, C438S106000
Reexamination Certificate
active
06958529
ABSTRACT:
An acceleration sensor which is inexpensive and accomplishes its small-size and light-weight structure, and a manufacturing method thereof. A sensor unit provided on a base is sealed by a cap joined to a frame portion of the base in an eutectic manner. The cap includes a cap main body made of a semiconductor material having a conductive property and a metal film provided on the circumferential edge of the cap main body. The frame portion includes a frame main body made of doped polysilicon, a diffusion preventive film selectively provided on the frame main body, and a joining layer. The joining layer has one area as a conductive portion made of a conductive material, and another area as a joining portion made of a semiconductor.
REFERENCES:
patent: 5343602 (1994-09-01), Plankenhorn
patent: 5668033 (1997-09-01), Ohara et al.
patent: 6441450 (2002-08-01), Yamaguchi et al.
patent: 6694814 (2004-02-01), Ishio
patent: 2001/0040262 (2001-11-01), Uchida et al.
patent: 42 01 104 (1993-05-01), None
patent: 102 00 873 (2002-08-01), None
patent: 7-92186 (1995-04-01), None
patent: 7-273351 (1995-10-01), None
patent: 8-306936 (1996-11-01), None
patent: 10-79520 (1998-03-01), None
patent: 11-220141 (1999-08-01), None
patent: 2000-164890 (2000-06-01), None
patent: 2000-286430 (2000-10-01), None
patent: 2001-119040 (2001-04-01), None
patent: WO 99/31515 (1999-06-01), None
Horikawa Makio
Ishibashi Kiyoshi
Okumura Mika
Mitsubishi Denki & Kabushiki Kaisha
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Tsai H. Jey
LandOfFree
Acceleration sensor and method of manufacture thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Acceleration sensor and method of manufacture thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Acceleration sensor and method of manufacture thereof will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3438743