Wave transmission lines and networks – Dissipating terminations for long lines – Fluid-cooling
Patent
1996-09-12
1997-09-23
Gensler, Paul
Wave transmission lines and networks
Dissipating terminations for long lines
Fluid-cooling
333172, 338216, H01P 126
Patent
active
056709170
ABSTRACT:
The present invention is directed to an AC termination which includes a substrate having first and second surfaces. A resistor is mounted on the first surface of the substrate. An input termination is at one end of the resistor. At least one plate of a capacitor is on the substrate and is electrically connected in series with the other end of the resistor. In one form of the termination, the capacitor is a metal film on the substrate extending from the other end of the resistor to and across the second surface of the substrate to form one electrode of the capacitor. A dielectric layer is over the metal film and another metal film extends over the dielectric layer to form the other electrode of the capacitor and the output termination of the termination. In another form of the termination, the capacitor is formed on a cover plate which extends over the first surface of the substrate and is electrically connected between the resistor and an output termination. In still another form of the termination, the substrate is of a conductive metal and forms one electrode of the capacitor, and a layer of a dielectric material extends over the second surface of the substrate.
REFERENCES:
patent: 2989665 (1961-06-01), Khouri
patent: 3534248 (1970-10-01), Houda, Jr. et al.
patent: 3654573 (1972-04-01), Graham
patent: 3967222 (1976-06-01), Toro
patent: 4020222 (1977-04-01), Kausche et al.
patent: 5047737 (1991-09-01), Oldfield
Cohen Donald S.
EMC Technology Inc.
Gensler Paul
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