Absorbent device using an apertured nonwoven as an...

Details Absorbent device using an apertured nonwoven as an... Absorbent device using an apertured nonwoven as an...

2007-04-17

2007-04-17

Gray, Linda (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S251000, C156S222000, C156S244190, C156S308400, C156S514000, C156S515000, C156S269000, C083S030000, C083S039000, C264S156000

Reexamination Certificate

active

10783428

ABSTRACT:
A method of making a composite intermediate layer by forming a resilient three dimensional apertured formed film; forming a nonwoven web of fibers; joining the nonwoven web with the apertured formed film; and aperturing the joined nonwoven web and formed film to create large scale apertures in the joined nonwoven web and formed film.

REFERENCES:
patent: 5188625 (1993-02-01), Van Iten
patent: 5567501 (1996-10-01), Srinivasan
patent: 5709921 (1998-01-01), Shawver
patent: 6039906 (2000-03-01), Sageser
patent: 6106925 (2000-08-01), Palumbo
patent: 0 165 807 (1985-12-01), None
patent: 2272917 (1994-01-01), None
patent: 62109621 (1987-05-01), None
patent: 06270340 (1994-09-01), None
patent: 06328600 (1994-11-01), None
patent: 06328601 (1994-11-01), None
patent: 10-80968 (1998-03-01), None
International Search Report of the Patent Cooperation Treaty for International Application No. PCT/US05/05558 dated Dec. 29, 2005.
Written Opinion of the International Searching Authority for International Application No. PCT/US05/05558 dated Dec. 29, 2005.

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