Abrasives for copper CMP and methods for making

Details Abrasives for copper CMP and methods for making Abrasives for copper CMP and methods for making

2005-07-05

2005-07-05

Marcheschi, Michael A. (Department: 1755)

Abrasive tool making process, material, or composition

With inorganic material

Clay, silica, or silicate

C106S003000

Reexamination Certificate

active

06913634

ABSTRACT:
An aqueous chemical mechanical polishing slurry is provided that comprises precipitated amorphous silica abrasive particles treated with acidic aluminum. Also provided is a method of polishing an electronic component substrate comprising the steps of: a) obtaining an electronic component substrate, the electronic component substrate having an insulating film deposited over it, an interconnection pattern formed in the insulating film, and interconnection material deposited on the insulated film and in the interconnection pattern; and b) polishing the interconnection material until a surface of said insulating film is exposed by using an aqueous chemical mechanical polishing slurry comprising: precipitated amorphous silica abrasive particles treated with acidic aluminum.

REFERENCES:
patent: 4040858 (1977-08-01), Wason
patent: 4122160 (1978-10-01), Wason
patent: 5447704 (1995-09-01), Aldcroft et al.
patent: 5939051 (1999-08-01), Santalucia et al.
patent: 6098906 (2000-08-01), Angeletakis

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