Abrasive polishing pad with covalently bonded abrasive particles

Details Abrasive polishing pad with covalently bonded abrasive particles Abrasive polishing pad with covalently bonded abrasive particles

1997-04-09

1999-03-09

Rose, Robert A.

Abrading

Abrading process

Glass or stone abrading

451285, 451921, 451526, 451532, 51293, 51298, 51306, B24B 500

Patent

active

058792228

ABSTRACT:
The inventive polishing pad is used for planarizing semiconductor wafers or other substrates with a mechanical or CMP process; the polishing pad preferably has a body made from a matrix material, bonding molecules bonded to the matrix material, and abrasive particles bonded to the bonding molecules in a manner that affixes the abrasive particles to the matrix material and substantially maintains the affixation between the matrix material and the abrasive particles in the presence of an electrostatic CMP slurry or other planarizing solution. The bonding molecules are preferably covalently attached to the matrix material and substantially all of the abrasive particles are preferably covalently bonded to at least one bonding molecule. The bonding molecules securely affix the abrasive particles to the matrix material to preferably enhance the uniformity of the distribution of the abrasive particles throughout the pad and to substantially prevent the abrasive particles from detaching from the pad during planarization.

REFERENCES:
patent: 3617347 (1971-11-01), Kuratomi
patent: 4565771 (1986-01-01), Lynch et al.
patent: 4954142 (1990-09-01), Carr et al.
patent: 5127196 (1992-07-01), Morimoto et al.
patent: 5197999 (1993-03-01), Thomas
patent: 5213588 (1993-05-01), Wong et al.
patent: 5250085 (1993-10-01), Mevissen
patent: 5433650 (1995-07-01), Winebarger
patent: 5624303 (1997-04-01), Robinson

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