Abrasive pad and manufacturing method thereof and substrate poli

Details Abrasive pad and manufacturing method thereof and substrate poli Abrasive pad and manufacturing method thereof and substrate poli

1998-02-13

1999-08-31

Breneman, Bruce

Abrading

Machine

Rotary tool

156345, 264258, B24B 2900

Patent

active

059445890

ABSTRACT:
An abrasive pad whose abrasive surface has recesses that allow abrasive slurry to stay there is used instead of forming scratches on the abrasive surface of an abrasive pad. This eliminates a dressing operation for forming innumerable scratches on the abrasive surface of an abrasive pad in polishing a wafer. Omitting a dressing step from a wafer polishing process lowers the degree of impurity contamination of a wafer, and eliminating a dresser from a polishing apparatus reduces its cost.

REFERENCES:
patent: 5209760 (1993-05-01), Wiand
patent: 5584146 (1996-12-01), Shamouillan et al.
patent: 5736463 (1998-04-01), Sato

Affiliated with

Also associated with

Rating

Abrasive pad and manufacturing method thereof and substrate poli does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Abrasive pad and manufacturing method thereof and substrate poli, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Abrasive pad and manufacturing method thereof and substrate poli will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2424727