Abrasive, method of polishing target member and process for...

Details Abrasive, method of polishing target member and process for... Abrasive, method of polishing target member and process for...

2006-10-03

2006-10-03

Hail, III, Joseph J. (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S307000, C451S308000, C451S309000

Reexamination Certificate

active

07115021

ABSTRACT:
To polish polishing target surfaces of SiO2insulating films or the like at a high rate without scratching the surface, the present invention provides an abrasive comprising a slurry comprising a medium and dispersed therein at least one of i) cerium oxide particles constituted of at least two crystallites and having crystal grain boundaries or having a bulk density of not higher than 6.5 g/cm3and ii) abrasive grains having pores. Also provided are a method of polishing a target member and a process for producing a semiconductor device which make use of this abrasive.

REFERENCES:
patent: 4475981 (1984-10-01), Rea
patent: 5026421 (1991-06-01), Le Loarer et al.
patent: 5264010 (1993-11-01), Brancaleoni et al.
patent: 5389352 (1995-02-01), Wang
patent: 5527423 (1996-06-01), Neville et al.
patent: 5543126 (1996-08-01), Ota et al.
patent: 5772780 (1998-06-01), Homma et al.
patent: 5775980 (1998-07-01), Sasaki et al.
patent: 5804513 (1998-09-01), Sakatani et al.
patent: 5891205 (1999-04-01), Picardi et al.
patent: 5994260 (1999-11-01), Bonneau et al.
patent: 5997620 (1999-12-01), Kodama et al.
patent: 6120571 (2000-09-01), Aihara et al.
patent: 2263241 (1998-09-01), None
patent: 0 820 092 (1998-01-01), None
patent: 0 939 431 (1999-09-01), None
patent: 60-108489 (1985-06-01), None
patent: 1-266183 (1989-10-01), None
patent: 781932 (1995-03-01), None
patent: 07-81932 (1995-03-01), None
patent: 7-502778 (1995-03-01), None
patent: 07-502778 (1995-03-01), None
patent: 08-181218 (1996-03-01), None
patent: 8-134435 (1996-05-01), None
patent: 13577 (1996-10-01), None
patent: WO 93/22103 (1993-11-01), None
patent: WO 97/29510 (1997-08-01), None
patent: WO 98/14987 (1998-04-01), None
patent: WO 01/13417 (1999-10-01), None
1996 Proceedings First International Chemical-Mechanical Polish (C.M.P.) for VLSI/ULSI Multilevel Interconnection Conference (CMP-MIC) “Selective CMP of Organic Sog for Low Parasitic Capacitance Quarter-Micron Multilevel Interconnections”, By: Yoshio Homa, et al. Feb. 22-23, 1996.
Communication and European Search Report mailed Jun. 18, 2004, for No. EP 98 96 1410.
Japanese Office Action for corresponding Application No. JP 2000-539103, dated May 25, 2004 with English-language translation.
“The Rietveld Method”, Oxford University Press (1993).
McGraw-Hill Dictionary of Scientific and Technical Terms (5thEd.) (1994) p. 388.
“Particle Size Distributions from Angular Variation of Intensity of Forward-Scattered Light at Very Small Angles” J. Chem. Phys., vol. 59, pp. 841-844 (1955).
“The Determination of Pore Volume and Area Distribution in Porous Substances. I. Computations from Nitrogen Isotherms” J. Am. Chem. Soc., vol. 73, pp. 373-380 (1951).
Canadian, Office Action, for Application No. 2,315,057, dated May 9, 2003.
Canadian Office Action, for Application No. 2,315,057, dated Jul. 7, 2004.
Canadian Office Action, for Application No. 2,315,057, dated Aug. 15, 2005.

Affiliated with

Also associated with

Rating

Abrasive, method of polishing target member and process for... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Abrasive, method of polishing target member and process for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Abrasive, method of polishing target member and process for... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3712749