Abrasive, method of polishing target member and process for...

Details Abrasive, method of polishing target member and process for... Abrasive, method of polishing target member and process for...

2011-06-21

2011-06-21

Hail, III, Joseph J (Department: 3723)

Abrading

Abrading process

Ring, tube, bushing, sleeve, or cylinder abrading

C051S307000, C051S308000, C051S309000

Reexamination Certificate

active

07963825

ABSTRACT:
To polish polishing target surfaces of SiO2insulating films or the like at a high rate without scratching the surface, the present invention provides an abrasive comprising a slurry comprising a medium and dispersed therein at least one of i) cerium oxide particles constituted of at least two crystallites and having crystal grain boundaries or having a bulk density of not higher than 6.5 g/cm3and ii) abrasive grains having pores. Also provided are a method of polishing a target member and a process for producing a semiconductor device which make use of this abrasive.

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