Compositions – Etching or brightening compositions
Reexamination Certificate
2005-05-24
2005-05-24
Norton, Nadine G. (Department: 1765)
Compositions
Etching or brightening compositions
C252S079400, C438S692000
Reexamination Certificate
active
06896825
ABSTRACT:
An abrasive liquid for a metal comprising (1) an oxidizing agent for a metal, (2) a dissolving agent for an oxidized metal, (3) a first protecting film-forming agent such as an amino acid or an azole which adsorbs physically on the surface of the metal and/or forms a chemical bond, to thereby form a protecting film, (4) a second protecting film-forming agent such as polyacrylic acid, polyamido acid or a salt thereof which assists the first protecting film-forming agent in forming a protecting film and (5) water; and a method for polishing.
REFERENCES:
patent: 4051057 (1977-09-01), Ericson et al.
patent: 4537654 (1985-08-01), Berenz et al.
patent: 4954142 (1990-09-01), Carr et al.
patent: 4968381 (1990-11-01), Prigge et al.
patent: 5084071 (1992-01-01), Nenadic et al.
patent: 5434107 (1995-07-01), Paranjpe
patent: 5575885 (1996-11-01), Hirabayashi et al.
patent: 5607718 (1997-03-01), Sasaki et al.
patent: 5691219 (1997-11-01), Kawakubo et al.
patent: 5733819 (1998-03-01), Kodama et al.
patent: 5770095 (1998-06-01), Sasaki et al.
patent: 5770103 (1998-06-01), Wang et al.
patent: 5876490 (1999-03-01), Ronay
patent: 5932486 (1999-08-01), Cook et al.
patent: 5954997 (1999-09-01), Kaufman et al.
patent: 5981394 (1999-11-01), Ohashi et al.
patent: 6117783 (2000-09-01), Small et al.
patent: 6206756 (2001-03-01), Chopra et al.
patent: 6313039 (2001-11-01), Small et al.
patent: 0 845 512 (1998-06-01), None
patent: 0 846 742 (1998-06-01), None
patent: 2-278822 (1990-11-01), None
patent: 6-88258 (1994-03-01), None
patent: 7-233485 (1995-09-01), None
patent: 08-083780 (1996-03-01), None
patent: 09184081 (1997-07-01), None
patent: 10-163141 (1998-06-01), None
patent: 2000-501771 (2000-02-01), None
patent: 2001-53167 (2001-06-01), None
patent: WO 9826025 (1998-06-01), None
patent: WO 0000561 (2000-01-01), None
Hayashi, Y. et al., A New Abrasive-Free, Chemical-Mechanical-Polishing for Aluminium Metallization of ULSI Devices, International Electron Devices Meeting Technical Digest, 1992, pp. 976-978.*
Luo et al., Chemical-Mechanical Polishing of Copper in Acidic Media, Feb. 22-23, 1996, 1996 CMP-MIC Conference 1996 ISMIC—100P/96/0145, pp. 145-151.*
Written Opinion from the Australian Patent Office for Application No. SG 200200664-1, mailed Aug. 23, 2004.
Honma Yoshio
Hoshino Tetsuya
Kamigata Yasuo
Kondoh Seiichi
Matsuzawa Jun
Antonelli Terry Stout & Kraus LLP
Hitachi Chemical Company, LTD
Norton Nadine G.
Umez-Eronini Lynette T.
LandOfFree
Abrasive liquid for metal and method for polishing does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Abrasive liquid for metal and method for polishing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Abrasive liquid for metal and method for polishing will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3420060