Abrasive-free chemical mechanical polishing compositions and...

Details Abrasive-free chemical mechanical polishing compositions and... Abrasive-free chemical mechanical polishing compositions and...

2004-11-24

2008-10-14

Goudreau, George A. (Department: 1792)

Compositions

Etching or brightening compositions

C252S079200, C252S079300, C252S079400

Reexamination Certificate

active

07435356

ABSTRACT:
An aqueous abrasive-free composition is useful for chemical mechanical polishing of a patterned semiconductor wafer containing a nonferrous metal. The composition comprises an oxidizer, an inhibitor for the nonferrous metal, 0 to 15 weight percent water soluble modified cellulose, 0 to 15 weight percent phosphorus compound, 0.005 to 5 weight percent of an amphiphilic polymer, the amphiphilic polymer having an ionic hydrophilic portion with a carbon number of 2 to 250 and water.

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