Abrasive construction for semiconductor wafer modification

Details Abrasive construction for semiconductor wafer modification Abrasive construction for semiconductor wafer modification

1997-08-20

1999-12-28

Rose, Robert A.

Abrading

Abrading process

Glass or stone abrading

451552, 451553, 451534, B24B 500

Patent

active

060074078

ABSTRACT:
An abrasive construction for modifying a surface of a workpiece, such as a semiconductor wafer. The abrasive construction comprises: a three-dimensional, textured, fixed abrasive element; at least one resilient element generally coextensive with the fixed abrasive element; and at least one rigid element generally coextensive with and interposed between the resilient element and the fixed abrasive element, wherein the rigid element has a Young's Modulus greater than that of the resilient element.

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