Abrasive construction for semiconductor wafer modification

Abrading – Rigid tool – Stationary

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Details

451533, 451 41, 451285, 51293, 51297, B23F 2103

Patent

active

056929501

ABSTRACT:
An abrasive construction for modifying a surface of a workpiece, such as a semiconductor wafer. The abrasive construction comprises: a three-dimensional, textured, fixed abrasive element; at least one resilient element generally coextensive with the fixed abrasive element; and at least one rigid element generally coextensive with and interposed between the resilient element and the fixed abrasive element, wherein the rigid element has a Young's Modulus greater than that of the resilient element.

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