Abrasive articles comprising a fluorochemical agent for wafer su

Details Abrasive articles comprising a fluorochemical agent for wafer su Abrasive articles comprising a fluorochemical agent for wafer su

1997-09-19

2000-09-19

Dawson, Robert

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

51295, 156345, 428145, 428409, 428447, 437225, 437946, 437974, 451530, H01L 21302

Patent

active

061211435

ABSTRACT:
This invention relates to fixed abrasive articles and abrasive constructions containing at least one fluorochemical agent. The fixed abrasive articles and abrasive constructions are used in semiconductor wafer surface modification processes during the fabrication of semiconductor devices. Specifically, fixed abrasive articles comprise an abrasive composite that is coextensive with a backing and at least one fluorochemical agent associated with the composite. The invention further relates to methods of making fixed abrasive articles comprising at least one fluorochemical agent.

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