A process for removing corrosive by-products from a circuit asse

Details A process for removing corrosive by-products from a circuit asse A process for removing corrosive by-products from a circuit asse

1993-02-05

1994-02-22

Bell, Mark L.

Cleaning and liquid contact with solids

Processes

Using sequentially applied treating agents

134 2, 134 3, 134 26, 134 28, 134 29, 134 41, B08B 308, C23G 102

Patent

active

052883329

ABSTRACT:
The invention is a process for removing corrosive by-products from semiconductor assembly by applying an aqueous spray comprising a saponifying agent to release and dissolve flux constituents and applying an acidic aqueous spray to the assembly to dissolve metal contaminants. While the acid source in the aqueous spray may be any number of constituents, preferably carbon dioxide is used. Metal released by the aqueous acid spray is inactivated and bound by a chelating agent which is introduced into the wash. The invention is applicable to any semiconductor device or assembly made through processes using bonding materials such as solder which may have by-products which are corrosive or otherwise deleterious to the device or device assembly once placed in the chosen environment of use.

REFERENCES:
patent: 3799803 (1974-03-01), Breazeale et al.
patent: 4610728 (1986-09-01), Natesh et al.
patent: 4640719 (1987-02-01), Hayes et al.
patent: 4740247 (1988-04-01), Hayes et al.
patent: 4778532 (1988-10-01), McConell et al.
patent: 4934391 (1990-06-01), Futch et al.
patent: 4983224 (1991-01-01), Mombrun et al.
patent: 5049200 (1991-09-01), Brunner et al.
patent: 5129955 (1992-07-01), Tanaka et al.
patent: 5181985 (1993-01-01), Lampert et al.
IBM Technical Disclosure Bulletin, vol. 17, No. 8 (Jan. 1975), Semiconductor Cleaning Process.
IBM Technical Disclosure Bulletin, vol. 19, No. 10 (Mar. 1977), Rinsing Semiconductor Bodies Without Depositing Heavy Metal Cations on Their Surface.

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