A method of making a circuit board and a circuit board produced

Details A method of making a circuit board and a circuit board produced A method of making a circuit board and a circuit board produced

1986-07-02

1988-06-14

Gallagher, John J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including aperture

29830, 29832, 29853, 156182, 156252, 156277, 156293, 156298, 1563073, 1563096, 174 685, 428140, 428901, B05D 510, B32B 3100

Patent

active

047511265

ABSTRACT:
A circuit board is prepared such that at least two resin substrates are laminated and bonded by thermocompression, a circuit pattern made of a resin composition containing a conductor material is formed on at least one of opposing surfaces of the substrates, a region of the substrate which corresponds to a specific portion of the circuit pattern is recessed, the specific portion of the circuit projects into the recess in accordance with plastic deformation of the substrates and the circuit pattern which is caused by thermocompression bonding, and the specific portion of the circuit pattern constitutes an exposed portion. Multilayer or three-dimensional wiring can be easily achieved in the circuit board.

REFERENCES:
patent: 2683839 (1954-07-01), Beck
patent: 2958120 (1960-11-01), Taylor
patent: 3010863 (1961-11-01), Coe et al.
patent: 3135823 (1964-06-01), Pritikin
patent: 3431350 (1969-03-01), Haberrecht
patent: 3501832 (1970-03-01), Iwata et al.
patent: 3670205 (1972-06-01), Dixon et al.
patent: 3680209 (1972-08-01), Hacke
patent: 4377652 (1983-03-01), Ohmura et al.
patent: 4394710 (1983-07-01), Brower et al.
patent: 4517050 (1985-05-01), Johnson et al.

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