A lead-free solder composition

Details A lead-free solder composition A lead-free solder composition

1994-01-21

1995-07-25

Simmons, David A.

Alloys or metallic compositions

Tin base

Copper containing

420559, 420560, 148400, 148405, C22C 1300

Patent

active

054359686

ABSTRACT:
An enhanced bonding design utilizing tin and copper to create tin alloy solders for use in the manufacturing of heat exchangers and other soldering applications. The tin alloy solders contain as primary constituent metals 3.0-15.0 wt. % copper and 79.0-97.0 wt. % tin, and containing as optional constituent metals 0.0-4.0 wt. % silver, 0.0-1.0 wt. % selenium and 0.0-1.0 wt. % bismuth. These solder alloys have lower toxicity levels and better corrosion resistance than the lead based alloy solders commonly employed. Also, because the application temperature range for these solder alloys is below the temperature where dezincification of copper/zinc base metal alloys occurs, joints on copper/zinc base metals subjected to cyclic loads are stronger when constructed using these tin alloy solders than when constructed of lead based alloy solders.

REFERENCES:
patent: 4693501 (1987-09-01), Logsdon, Jr. et al.
patent: 4739630 (1988-04-01), Tandeski et al.
patent: 4758407 (1988-07-01), Ballentine et al.
patent: 4817857 (1989-04-01), Hargrove et al.
patent: 4879096 (1989-11-01), Naton
patent: 4935076 (1990-06-01), Yamaguchi et al.
patent: 5102748 (1992-04-01), Wylam et al.

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