3D MMIC balun and methods of making the same

Details 3D MMIC balun and methods of making the same 3D MMIC balun and methods of making the same

2005-09-02

2009-08-04

Jones, Stephen E (Department: 2817)

Wave transmission lines and networks

Coupling networks

Balanced to unbalanced circuits

C333S026000, C336S200000

Reexamination Certificate

active

07570129

ABSTRACT:
A three dimensional (3D) monolithic integrated circuit (MMIC) balun and methods of making the same are provided. A primary spiral winding is spaced apart from a secondary primary winding by a gap in a substantially aligned stacked configuration forming a balun. The gap medium can be a low dielectric constant material if employing a multi-metal process or air if employing a wafer level packaging process.

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Communication Relating to the Results of the Partial International Search for corresponding PCT/US2006/033954completed by Officer Eva Weman and mailed on Jan. 24, 2007.

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