3D imaging of a substrate using perpendicular scanning direction

Facsimile and static presentation processing – Facsimile – Specific signal processing circuitry

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

358107, 358 88, 358106, 356373, 382 8, H04N 718

Patent

active

049656651

ABSTRACT:
A system (10) for obtaining a three-dimensional image of a substrate (12) comprises a linescan camera (20) trained on the substrate normal to the plane of its surface to capture the image of a strip of area (S.sub.y) running along a first axis. A reflective member (38), driven by a motor (39), spans a line of light (36) generated by a laser (30) at an angle across the surface of the substrate so each of a plurality of strips of area (S.sub.a,S.sub.b,S.sub.c. . . ), including the strip (S.sub.y) imaged by the camera, is successively illuminated. A processing device (26) is coupled both to the camera (20) and to the motor (39) to synchronize them so that the camera captures the image of the strip within its field of view each time a successive one of the strips (S.sub.a,S.sub.b,S.sub.c. . . S.sub.y) is illuminated. The processing device (26) further serves to process the successively captured images of the strip (S.sub.y) within the field of view of the camera to obtain a three-dimensional image of the strip. A relative motion is imparted between the linescan camera (20) and the substrate (12) by a slide to enable a three-dimensional image of the substrate to be obtained.

REFERENCES:
patent: 4113389 (1978-09-01), Kaye
patent: 4647208 (1937-03-01), Bieman
patent: 4677473 (1987-06-01), Okamoto et al.
patent: 4731853 (1988-03-01), Hata et al.
patent: 4767212 (1988-08-01), Kitahashi et al.
patent: 4811410 (1989-03-01), Amir et al.
patent: 4849645 (1989-07-01), Mendenko et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

3D imaging of a substrate using perpendicular scanning direction does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with 3D imaging of a substrate using perpendicular scanning direction, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and 3D imaging of a substrate using perpendicular scanning direction will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-770844

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.