3-D packaging of focal plane assemblies

Details 3-D packaging of focal plane assemblies 3-D packaging of focal plane assemblies

1988-10-31

1989-10-31

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437 48, 437225, 437249, 437915, 437226, 148DIG164, H01L 21302

Patent

active

048777528

ABSTRACT:
In three-dimensional packaging of focal plane signal processing electroni the necessity of routing conductors from the face of the die to the edge of the die in the module for placement of inter-connection pads for interconnection to the next assembly presents the problem of electrical isolation of the conductors from adjacent silicon dies and their underlying silicon substrate. This problem is avoided by the use of a gold ribbon lead that is bonded to the face of each die. The ribbons function as electrically isolated conductive risers upon which inter-connection pads are placed for connection to the next assembly and as precision spacers between stacked dies during module assembly.

REFERENCES:
patent: 4734380 (1988-03-01), Tsang
patent: 4737470 (1988-03-01), Bean

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