3-D graphics chip with embedded DRAM buffers

Details 3-D graphics chip with embedded DRAM buffers 3-D graphics chip with embedded DRAM buffers

2001-10-01

2003-02-11

Tung, Kee M. (Department: 2671)

Computer graphics processing and selective visual display system

Computer graphic processing system

Integrated circuit

C345S558000, C345S531000

Reexamination Certificate

active

06518972

ABSTRACT:

FIELD OF THE INVENTION
The invention relates to the field of computer graphics devices and more specifically to specialized processors for accelerating a color, 3-dimensional (“3-D”) drawing process used with laptop computers having high-end game and multimedia capability.
BACKGROUND OF THE INVENTION
The acceleration of a color, texture rendering 3-D drawing process is well known in the field of computer graphics. In the past such accelerators have relied primarily upon the use of external 3-D drawing buffers for storage of 3-D process control and 3-D drawing information. However, the use of external drawing buffers has made it difficult to increase accelerator throughput. Yet continuing advances in computer graphics capabilities have pushed a demand for higher bandwidth 3-D drawing processes, having greater throughput, to support high-end games and multimedia applications.
This need for greater throughput has been a special challenge to the designers of 3-D graphics accelerators for use in high-end laptop computers and in some battery-operated hand-held devices. These special markets place a premium on small size and low operating power. The designers of these specialized chips face practical limitations to solving their problems by increasing the number of I/O pins at the periphery of a chip in an effort to continue using external drawing buffers. A typical external memory bus now includes 64 lines which cannot be shared with other I/O signals. Yet many of these chips already have in excess of 200 I/O pins, thus making the addition of 100-200 pins impractical. For this reason, the industry has begun to move away from external memory and toward internal memory.
Recently, some devices have included small static-RAM (“SRAM”) cache memories in an effort to provide the higher throughput (“effective processing bandwidth”). A few 3-D graphics accelerators have implemented larger internal SRAM buffers for storage of setup and intermediate drawing information, but these are limited to desktop computers where size and power are not a major consideration.
The use of SRAM for internal storage has several drawbacks for accelerators intended for the high-end laptop market: (1) if limited to internal cache memory only, the improvement in processing bandwidth is not significant; (2) SRAM requires much layout area, limiting the amount of storage which can be provided, and hence the improvement in processing bandwidth; and (3) SRAM is a power hungry technology not lending itself to use in battery operated equipment. These limitations prevent successful use of SRAM for large internal memories on the order of 2 MB or more, which is a size required for the needed improvement in processing throughput.
Recently, several manufacturers have proposed 3-D graphics accelerators for use in the high-end laptop market which include dynamic-RAM (“DRAM”) for internal buffer storage. DRAM has the advantages of lower power consumption and smaller layout area for a given memory size. Though these proposed devices promise 2 MB memories and therefore a dramatic improvement in performance, the announced architectures appear to have shortcomings which will severely undercut the manufacturers' claims.
SUMMARY OF THE INVENTION
The present invention overcomes these objections by organizing the internal memory as multiple independent memory banks, each having its own very wide access bus and memory controller. The present invention takes advantage of this internal memory organization by modifying a traditional 3-D drawing engine to take advantage of the memory architecture to increase the 3-D drawing process throughput by a factor of 3. This result is accomplished by connecting each of three drawing processes which comprise a traditional 3-D drawing process to a separate internal memory and then reconfiguring the three drawing processes to reduce unnecessary delays.
In a specific embodiment, the internal memory is implemented as independent memory banks of at least 1 MB each. Each independent memory bank has its own access bus, typically 128 bits wide. The 3-D drawing engine connects to the memories via read and write FIFO's of equivalent width. The modified 3-D drawing engine defines ‘concurrent’ 3-D drawing processes as opposed to a traditional ‘pipelined’ architecture.
In another specific embodiment of a 3-D graphics chip having embedded DRAM buffers, the invention includes a matrix of programmable switches which independently connect each of several interrelated drawing processes to one of the independent internal buffers. The switch matrix is programmable by a host computer and is useful for adjusting the graphics accelerator to meet the needs of specific applications. The switch matrix permits any drawing engine to communicate with any internal memory bank, once a host selection has been made.
In another specific embodiment, the invention includes an external bus permitting one or more drawing buffers to be located external to the graphics accelerator. A programmable switch matrix is used to connect selected drawing processes to either an internal buffer or to an external buffer via the external bus, thus providing a simple form of drawing process output to the external buffer.


REFERENCES:
patent: 5544306 (1996-08-01), Deering et al.
patent: 5548709 (1996-08-01), Hannah et al.
patent: 5650955 (1997-07-01), Puar et al.
patent: 6108015 (2000-08-01), Cross
Watanabe et al, “A Modular Architecture for a 6.4 Gbyte/s, 8-Mb DRAM Integrated Media Chip”, IEEE Journal of Solid State Circuits, vol. 32, No. 5, May 1997, pp. 635-641.
Junko Yoshida, “Startup Turns Up Heat in 3-D Graphics Chips”, Aug. 17, 1998, Electronic Engineering Times, p. 26.

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