2,6-disubstituted 4-epoxypropylphenyl glycidyl ethers and the us

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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525481, 528 87, 528 91, 528 93, 528 94, 528102, 528103, 528104, 528109, 528111, 528112, 528122, 528123, 528124, 549525, 549555, 549559, 1563073, C08G 5924

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047240318

ABSTRACT:
2,6-Disubstituted 4-epoxypropyl glycidyl ethers of the formula ##STR1## wherein X is a group R' or X is a group of the formula ##STR2## and each of R and R' independently of the other is C.sub.1 -C.sub.4 alkyl, C.sub.1 -C.sub.4 alkoxy, a halogen atom or C.sub.6 -C.sub.10 aryl, can be used, together with customary epoxy resin hardeners, for the preparation of cured products, in particular for application in the electronics industry, or as adhesives. Compounds of the formula are also valuable reactive diluents for curable epoxy resin mixtures.

REFERENCES:
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patent: 2965608 (1960-12-01), Martin et al.
patent: 3374203 (1968-03-01), Schmukler
patent: 3773799 (1973-11-01), Schmid
patent: 3925315 (1975-12-01), Schmid
patent: 4384129 (1983-05-01), Zahir et al.
Houben-Weyl, Methoden Der Organischen Chemie, pp. 502-507
John D. Roberts & Marjorie C. Caserio, Basic Principles of Organic Chemistry, p. 907 (1965).

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