Semiconductor device manufacturing: process – Miscellaneous
Reexamination Certificate
2005-02-01
2005-02-01
Nelms, David (Department: 2818)
Semiconductor device manufacturing: process
Miscellaneous
C365S148000
Reexamination Certificate
active
06849564
ABSTRACT:
A low-capacitance one-resistor/one-diode (1R1D) R-RAM array with a floating p-well is provided. The fabrication method comprises: forming an integrated circuit (IC) substrate; forming an n-doped buried layer (buried n layer) of silicon overlying the substrate; forming n-doped silicon sidewalls overlying the buried n layer; forming a p-doped well of silicon (p-well) overlying the buried n layer; and, forming a 1R1D R-RAM array overlying the p-well. Typically, the combination of the buried n layer and the n-doped sidewalls form an n-doped well (n-well) of silicon. Then, the p-well is formed inside the n-well. In other aspects, the p-well has sidewalls, and the method further comprises: forming an oxide insulator overlying the p-well sidewalls, between the n-well and the R-RAM array.
REFERENCES:
patent: 5818749 (1998-10-01), Harshfield
patent: 6483368 (2002-11-01), Mayer et al.
Hsu Sheng Teng
Pan Wei
Zhang Fengyan
Zhuang Wei-Wei
Curtin Joseph P.
Nelms David
Rabdau Matthew D.
Ripma David C.
Sharp Laboratories of America Inc.
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