4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Metallic housing or support
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Rabin, Hill & Clark LLP

Law Firm

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Ramos Mary Jean Bajacan

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Rao Shriniras H.

Examiner

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Read Matthew S.

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Reichert Hans-Jörg

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Renavikar Mukul P

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Riddle Guy T.

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Romm Douglas W

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Rossman Mari J.

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Rothuizen Hugo E

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Rotter Shlomo Z.

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Rulloda, Jr. Onofre A.

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