4. Metal fusion bonding
  5. Including means to apply flux or filler to work or applicator
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Hitachi Techno Engineering Co. Ltd.

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Hodges Lee R.

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Honeywell Advanced Circuits, Inc.

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Hoshiba Hiroshi

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Hristov Hristomir D.

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Hueste Greg

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Hwang Byung-guk

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Hwang Simon

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I-Tsung Pan Alfred

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Ibuki Yoshiteru

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Iguchi Norio

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Ikedo Kenshi

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Iketaki Kenji

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Imaeda Toshihiko

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Innovative Soldering Technologies

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Ishii Ginya

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Itagaki Masato

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Ito Carl T.

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Ito Shigeo

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Jacobs Stephen W.

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