4. Metal fusion bonding
  5. Including means to apply flux or filler to work or applicator
  6. By partial or total immersion of work or applicator into liquid
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Toshiba Seiki Co., Ltd.

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Tu Yu-Chen

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Unisys Corporation

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Van Schaik Michiel J.

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Vitronics Soltec B.V.

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Volkert Willi

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Walega, Jr. John

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Wang Peng-Wei

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Wang Po-Hung

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Willis Scott E.

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Winther Douglas N.

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Wood, Jr. George R.

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Worthmann Rainer

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Wright Stanley J.

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Yerdon Timothy Joseph

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Yordanov Nikolay V.

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Zen Mitsuo

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Zevatron GmbH Gesellschaft fur Fertigungseinrichtungen der Elekt

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