4. Heat exchange
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  6. Electrical component
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Tasooji Matthew

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Tavassoli Bahman

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Teng Chia-Ru

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Terasaka Takao

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Terashima Toshinori

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Teytu Andre

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Thayer John G.

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The Board of Trustees of the Leland Stanford Junior Universty

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Theisen Sven

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Thermal Form & Function

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ThermaMasters, LLC

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Thompson Jason

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Tian Shan-Min

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Tien Chi-Wei

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Torii Yoshitsugu

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Tran Bryan H.

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Tranyoung Technology Corp.

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Trilogy Computer Development Partners, Ltd.

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Tsai Chin-Fu

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Tsai Chin-Fu

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