Method of bonding semiconductor chips to a substrate

Details Method of bonding semiconductor chips to a substrate Method of bonding semiconductor chips to a substrate

1993-02-09

1993-10-05

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

22818022, 228253, 228254, 427123, 437183, H01L 2160, H01L 2150

Patent

active

052497321

ABSTRACT:
In a method of bonding a pad on a semiconductor chip to a corresponding pad on a carrier, a wire ball is attached to the pad on the chip by bonding one end of a low melting temperature aluminum alloy bond wire to the chip pad. The wire is then broken off at the bond. A bead is formed on the chip pad by heating the ball to a temperature slightly above the melting point of the bond wire material for a predetermined period of time. The melted bead is then placed into contact with a corresponding pad on the carrier.

REFERENCES:
patent: 5090119 (1992-02-01), Tsuda et al.
patent: 5124277 (1992-06-01), Tsumura
patent: 5193738 (1993-03-01), Hayes

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