Method for manufacturing double-sided circuit assemblies

Details Method for manufacturing double-sided circuit assemblies Method for manufacturing double-sided circuit assemblies

1996-07-24

1997-10-21

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

22818021, H05K 334

Patent

active

056783043

ABSTRACT:
A method for manufacturing double-sided circuit assemblies by a surface mount process includes the steps of: arranging the circuit assemblies in arrays so that two or more circuit assemblies, at least one top side up and at least one bottom side up, are provided in each array; populating one side of the circuit assemblies in a first pass of the arrays through the surface mount process; flipping each array over; and populating the other side of the circuit assemblies in a second pass of the flipped arrays through the same surface mount process with no changes in stencil, placement program, or components.

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Electronic Equipment Packaging Technology, by G.L. Ginsberg. New York: Van Nostrand Reinhold, 1991, pp. 603-615.

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