Metal working – Method of mechanical manufacture – Electrical device making
Patent
1995-11-27
1997-10-21
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29840, 156634, 257 69, 324765, 437 8, 437206, 437220, H01R 4300
Patent
active
056783019
ABSTRACT:
A method for forming an interconnect for establishing electrical communication with a semiconductor die is provided. The method includes: providing a microbump tape and then mounting the tape to a substrate with a compliant layer therebetween. The microbump tape includes an insulating film having a pattern of microbump contact members corresponding to a pattern of bond pads on the die. The compliant layer can be formed of a curable adhesive such as a silicone elastomer. A coupon containing a plurality of microbump tapes can be mounted to a substrate wafer which can then be singulated to form a plurality of interconnects. The interconnects can be used with a testing apparatus for testing unpackaged semiconductor dice.
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Farnworth Warren M.
Gochnour Derek
Arbes Carl J.
Gratton Stephen A.
Micro)n Technology, Inc.
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