PC card housing with insulative cover and ground feature

Details PC card housing with insulative cover and ground feature PC card housing with insulative cover and ground feature

1998-08-06

2000-12-26

Cuchlinski, Jr., William A.

Electricity: conductors and insulators

Anti-inductive structures

Conductor transposition

174 521, 174 51, 174 35MS, 361753, 361752, 361757, 361818, 361800, H05K 900

Patent

active

061663247

ABSTRACT:
A card housing for printed circuit boards, wherein the card housing is provided with stamped covers having grounding members extending unitarily therefrom, wherein at least one grounding member is bent so that an outward surface of the grounding member is contiguous with an outward face of the cover. The cover having the bent grounding member is stamped from a metallic sheet having an insulative frame on one side that forms the outward face and surface. An insulative frame overlays a peripheral edge of each cover so that the two covers may be sealed to encase a printed circuit board inserted therein.

REFERENCES:
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patent: 5187642 (1993-02-01), Carner et al.
patent: 5339222 (1994-08-01), Simmons et al.
patent: 5397857 (1995-03-01), Farqquhar et al.
patent: 5425646 (1995-06-01), Green
patent: 5476387 (1995-12-01), Ramey et al.
patent: 5574628 (1996-11-01), Persia et al.
patent: 5627729 (1997-05-01), Oldendorf et al.
patent: 5749741 (1998-05-01), Bellas et al.
patent: 5886402 (1999-03-01), Onoda et al.

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