Transfer method of applying adhesive to substrates

Details Transfer method of applying adhesive to substrates Transfer method of applying adhesive to substrates

1986-08-01

1988-03-01

Czaja, Donald E.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156235, 40158B, 428 40, 428 45, 428352, A61F 1302, B32B 302, C09J 702, A47G 106

Patent

active

047283807

ABSTRACT:
A transfer adhesive sandwich includes a flexible carrier sheet having an adhesive layer releasably bonded to one surface and having an opposite surface to which the adhesive layer is releasably bondable with substantially less tenacity than the tenacity of the bond between the adhesive layer and the one surface. A plurality of the sandwiches are stacked on top of one another to form a pad from which individual sandwiches are strippable. When the adhesive layer is pressed against a substrate, it adheres to the substrate with a tenacity substantially greater than the tenacity of the bond between the adhesive layer and the one surface of the carrier sheet so that the carrier sheet can be stripped away to leave the adhesive layer on the substrate.

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