Semiconductor device, method of producing semiconductor device a

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support

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134 13, 451 38, 451 39, H01L 2144

Patent

active

061658197

ABSTRACT:
A method of producing a semiconductor device includes a device body producing step, electrically coupling leads and a semiconductor chip, and producing a device body by encapsulating the semiconductor chip by a resin package so that portions of the leads are exposed from the resin package, a honing step, carrying out a honing process using a polishing solution at least with respect to a resin flash adhered on the portions of the leads exposed from the resin package, an etching step, removing an unwanted stacked layer structure formed on the leads by carrying out an etching process after the honing step, and a plating step, carrying out a plating process with respect to the leads after the etching step to form a plated layer made of a soft bonding material. The honing step removes a portion of the unwanted stacked layer structure in addition to the resin flash.

REFERENCES:
patent: 4280132 (1981-07-01), Hayakawa et al.
patent: 4545155 (1985-10-01), Nakata
patent: 4697204 (1987-09-01), Mita et al.
patent: 5107325 (1992-04-01), Nakayoshi
patent: 5134773 (1992-08-01), LeMaire et al.
patent: 5172214 (1992-12-01), Casto
patent: 5304843 (1994-04-01), Takubo et al.
patent: 5363279 (1994-11-01), Cha
patent: 5444293 (1995-08-01), Li
patent: 5533922 (1996-07-01), Yamaharu
patent: 5938856 (1999-08-01), Sachdev
patent: 6074279 (2000-06-01), Yoshimura et al.

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