Polishing apparatus

Abrading – Machine – Rotary tool

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Details

451388, 451 41, B24B 722

Patent

active

054764149

ABSTRACT:
A workpiece such as a semiconductor wafer is supported on a top ring and polished by an abrasive cloth on a turntable while the top ring is being pressed against the turntable and the turntable and the top ring are being rotated. The top ring is coupled to a top ring drive shaft, coupled to a pressure cylinder for pressing the top ring, and to a motor for rotating the top ring. A spherical bearing is interposed between the top ring and the top ring drive shaft for allowing the top ring to align with the upper surface of the moving turntable. A torque transmitting mechanism is operatively coupled between the top ring and the top ring drive shaft for rotating the top ring in synchronization with the top ring drive shaft.

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Patent Abstracts of Japan, vol. 14, No. 32 (E-876) Jan. 22, 1990.
Patent Abstracts of Japan, vol. 6, No. 126 (M-142) Jul. 10, 1992.
Patent Abstracts of Japan, vol. 16, No. 177 (M-1241) Apr. 28, 1992.

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