Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1995-12-13
1998-05-12
Jackson, Jerome
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257713, 257718, 257719, 257724, H01L 23367
Patent
active
057510628
ABSTRACT:
A cooling device of a multi-chip module has micropackages that are independent of thermal deformation and easy to assembly and disassembly. The multi-chip module includes a multi-layer substrate on which the micropackages, each encasing an LSI chip, are mounted, and a housing formed integrally with a cooler. Each of the micropackages includes a first heat conduction member, having a cap portion for receiving the LSI chip and a first fin made of the same material as the cap portion to be integral therewith, and a substrate fixed to the cap portion of the first heat conduction member, the LSI chip being mounted on the substrate which is securely fixed to the cap portion of the heat conduction member while being fixedly joined at the back surface thereof to an inner surface of the cap portion of the first heat conduction member. Second heat conduction members, each including a base portion and a second fin, are disposed to engage with the first fins and be pressed against the cooler by a spring, respectively.
REFERENCES:
patent: 4649990 (1987-03-01), Kurihara et al.
patent: 5276289 (1994-01-01), Satoh et al.
patent: 5345107 (1994-09-01), Daikoku
patent: 5585671 (1996-12-01), Nagesh
Ashiwake Noriyuki
Daikoku Takahiro
Idei Akio
Kasai Kenichi
Kawamura Keizou
Hitachi , Ltd.
Jackson Jerome
LandOfFree
Cooling device of multi-chip module does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Cooling device of multi-chip module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling device of multi-chip module will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-983510