1984-05-14
1985-06-18
Edlow, Martin H.
357 20, 357 58, H01L 2906
Patent
active
045243760
ABSTRACT:
A semiconductor device, for example a p-i-n diode, comprises a corrugated semiconductor body having a plurality of complementary grooves and ridges on opposite sides of the body. The junction between the p-type region and the n-type intrinsic region has substantially the same configuration as, and extends substantially parallel to, the surface, while the junction between the n-type region and the intrinsic region similarly extends substantially parallel to the surface. Devices with narrow intrinsic regions can be made accurately by diffusion of the p-type region and the n-type region because the whole of the diode can be made relatively thin, for example, 90 micrometers without sacrificing strength and rigidity. In comparison with an equivalent planar device, the active area and current handling capability is increased. To avoid premature breakdown the diode may be surrounded by a thicker peripheral portion.
REFERENCES:
patent: 3150999 (1964-09-01), Rudenberg et al.
patent: 3163916 (1965-01-01), Gault
patent: 3363151 (1968-01-01), Chopra
patent: 3454835 (1969-07-01), Rosvold
patent: 3970843 (1976-07-01), Dumas
patent: 4032944 (1977-06-01), van Dongen et al.
patent: 4051507 (1977-09-01), Rosvold
patent: 4135950 (1979-01-01), Rittner
patent: 4277793 (1981-07-01), Webb
Edlow Martin H.
Henn Terri M.
Miller Paul R.
U.S. Philips Corporation
LandOfFree
Corrugated semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Corrugated semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Corrugated semiconductor device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-982695