Multilayer laminated substrates with high density interconnects

Details Multilayer laminated substrates with high density interconnects Multilayer laminated substrates with high density interconnects

1998-11-13

2000-12-26

Harrison, Jessica J.

Metal working

Method of mechanical manufacture

Electrical device making

29830, 29853, 174 36, 174262, 174263, 428457, 428458, 428901, H01K 310

Patent

active

061639575

ABSTRACT:
Multilayer circuit lamination methods and circuit layer structures are disclosed which enable one to manufacture high-density multichip module boards and the like at lower cost, with higher yield, with higher signal densities, and with fewer processing steps.

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Masakazu, et al., "Development of Multilayer Wiring Board by Simultaneous Stacking Method of Tape Film," Erekutoronikusu Jisso Gakkaishi (Journal of the Japan Institute of Electronics Packaging), vol. 1, No. 2, pp. 124-129, 1998.

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