Method of making chip scale package with heat spreade

Details Method of making chip scale package with heat spreade Method of making chip scale package with heat spreade

1999-06-29

2000-12-26

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29827, 29840, H05R 330

Patent

active

061639567

ABSTRACT:
A dense semiconductor flip-chip device assembly is provided with a heat sink/spreading/dissipating member which is formed as a paddle of a metallic paddle frame in a strip of paddle frames. Dice are bonded to the paddles by e.g. conventional die attach methods, enabling bump attachment and testing to be conducted before detachment from the paddle frame strip.

REFERENCES:
patent: 4024570 (1977-05-01), Hartmann et al.
patent: 4143456 (1979-03-01), Inoue
patent: 4264917 (1981-04-01), Ugon
patent: 4300153 (1981-11-01), Hayakawa et al.
patent: 4358552 (1982-11-01), Shinohara et al.
patent: 4507675 (1985-03-01), Fujii et al.
patent: 4642671 (1987-02-01), Rohsler et al.
patent: 4931852 (1990-06-01), Brown et al.
patent: 4961107 (1990-10-01), Geist et al.
patent: 5101465 (1992-03-01), Murphy
patent: 5173764 (1992-12-01), Higgins, III
patent: 5194930 (1993-03-01), Papathomas et al.
patent: 5214845 (1993-06-01), King et al.
patent: 5233220 (1993-08-01), Lamson et al.
patent: 5378924 (1995-01-01), Liang
patent: 5379186 (1995-01-01), Gold et al.
patent: 5379187 (1995-01-01), Lee et al.
patent: 5387554 (1995-02-01), Liang
patent: 5434105 (1995-07-01), Liou
patent: 5436203 (1995-07-01), Lin
patent: 5450283 (1995-09-01), Lin et al.
patent: 5488254 (1996-01-01), Nishimura et al.
patent: 5489538 (1996-02-01), Rostoker et al.
patent: 5489801 (1996-02-01), Blish, II
patent: 5490324 (1996-02-01), Newman
patent: 5528076 (1996-06-01), Pavio
patent: 5541446 (1996-07-01), Kierse
patent: 5550408 (1996-08-01), Kunitomo et al.
patent: 5559306 (1996-09-01), Mahulikar
patent: 5594282 (1997-01-01), Otsuki
patent: 5596231 (1997-01-01), Combs
patent: 5598034 (1997-01-01), Wakefield
patent: 5661086 (1997-08-01), Nakashima et al.
patent: 5708567 (1998-01-01), Shim et al.
patent: 5773896 (1998-06-01), Fujimoto et al.
patent: 5884396 (1999-03-01), Lin
patent: 5907769 (1999-05-01), Corisis

Affiliated with

Also associated with

Rating

Method of making chip scale package with heat spreade does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making chip scale package with heat spreade, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making chip scale package with heat spreade will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-981985