Method for manufacturing semiconductor elements equipped with le

Details Method for manufacturing semiconductor elements equipped with le Method for manufacturing semiconductor elements equipped with le

1990-04-16

1991-10-15

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29827, 228 51, 2281801, 361409, H01R 4302

Patent

active

050562177

ABSTRACT:
Method of manufacturing semiconductor elements equipped with leads which are connected to electrodes and formed of wires including the steps of positioning each semiconductor element on a bonding stage, feeding a tip end of the wire under a bonding tool so that the bonding tool presses the tip end against the electrode to bond it to the electrode, shifting the bonding tool to away from the tip end and pressing the wire against wire-cutting section of the bonding stage, and pulling the wire away from the bonding tool to cut the wire.

REFERENCES:
patent: 3430835 (1969-03-01), Grable et al.
patent: 3630450 (1972-03-01), Larson et al.
patent: 3673681 (1972-07-01), Steran Ka
patent: 4053096 (1977-10-01), Heim
patent: 4142288 (1979-03-01), Flammer et al.

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