Method of forming a decal having conductive paths thereon

Metal working – Method of mechanical manufacture – Electrical device making

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H05K 302

Patent

active

054210828

ABSTRACT:
A decal (51) having a conductive pattern is first fabricated. This fabrication includes plating a layer of a conductive material (22) using a thermal spraying method. After completing the fabrication of the decal (51) having the conductive pattern, the decal (51) is then affixed to a component (81). In one embodiment, heat and pressure is used to bond the decal (51) to the component (81). In an alternative embodiment, the decal (51) is placed in a mold (61) from which the component (81) is to be molded. Resin (71), forming the component (81), is then placed into the mold (61). After molding, a device comprising the component (81) with the conductive pattern is thus formed. The result of both embodiments is a device with a conductive pattern affixed on at least one of the device's surfaces.

REFERENCES:
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patent: 3085295 (1963-04-01), Pizzino et al.
patent: 3301730 (1967-01-01), Spiwak et al.
patent: 3350250 (1967-10-01), Sanz et al.
patent: 4424408 (1984-01-01), Elarde
patent: 4532152 (1985-07-01), Elarde
patent: 4694572 (1987-09-01), Leber et al.
patent: 4870751 (1989-10-01), Antoon
patent: 5013397 (1991-05-01), Tsukakoshi

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