Mold device and process for resin-packaging semiconductor device

Details Mold device and process for resin-packaging semiconductor device Mold device and process for resin-packaging semiconductor device

1996-08-28

1998-05-12

Nguyen, Khanh P.

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

425117, 425190, 425544, 425572, 425588, B29B 4502, B29B 4514, B29B 4527

Patent

active

057501530

ABSTRACT:
A mold device for resin-packaging semiconductor devices is provided which includes a first cavity block having a first molding cavity, a second cavity block having a second molding cavity in corresponding relation to the first molding cavity, and a gate for injecting a resin material into the first and second cavities through a runner. The gate is defined between an opposed pair of first and second gate pins at a corresponding corner portion of each molding cavity. The first gate pin is removably insertable into the first cavity block, whereas the second gate pin is removably insertable into the second cavity block. Further, the gate is directly open to both of the first and second molding cavities.

REFERENCES:
patent: 5123826 (1992-06-01), Baird
patent: 5302101 (1994-04-01), Nishimura
patent: 5635220 (1997-06-01), Izumi et al.
patent: 5645864 (1997-07-01), Higuchi

Affiliated with

Also associated with

Rating

Mold device and process for resin-packaging semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mold device and process for resin-packaging semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mold device and process for resin-packaging semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-977112