IC card

Registers – Coded record sensors – Particular sensor structure

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Details

357 72, 357 80, 235492, 235487, H01L 2312, H01L 2304, H01L 2314, H01L 2328

Patent

active

049624156

ABSTRACT:
An IC card is provided in which an IC chip is packaged in an opening formed in the IC card. One surface of the IC chip is laid on a film substrate on which external contact terminals are formed, and the other surface is covered with a reinforcing plate, the IC chip. The film substrate and the reinforcing plate are formed integrally in a thin plate-like module which is well-fitted in the above-mentioned opening while the external contact terminals on the film substrate are exposed externally.

REFERENCES:
patent: 4447716 (1984-05-01), Aigo
patent: 4649418 (1987-03-01), Uden
patent: 4682017 (1987-07-01), Nakahara et al.
patent: 4725924 (1988-02-01), Juan
patent: 4731645 (1988-03-01), Parmentier et al.
patent: 4731700 (1988-03-01), Woodward et al.

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