Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...
Patent
1989-08-07
1992-12-22
Sellers, Robert E.
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Mixing of two or more solid polymers; mixing of solid...
523414, 525108, 525119, 525454, 525523, 525533, 527503, 528482, 528485, 528487, C08G 5904, C08L 6300
Patent
active
051735482
DESCRIPTION:
BRIEF SUMMARY
FIELD OF THE INVENTION
This invention relates to epoxy-modified hydrocarbon resins which are useful as modifiers and base polymers for coatings, adhesives, rubbers, integrated circuit (IC) encapsulants, and the like and also useful as raw materials for compatibilizing agents for incompatible polymers.
BACKGROUND OF THE INVENTION
Hydrocarbon resins and hydrocarbon elastomers obtained from unsaturated aromatic hydrocarbons, namely from aromatic olefins or from fractions containing such aromatic olefins, have been used as modifiers for coatings, adhesives, rubbers, and IC encapsulants as they are capable of plasticizing base polymers, relaxing the internal stress generated during the curing of base polymers, increasing the initial tack and adhesive strength of base polymers, and improving the water resistance of base polymers. The modifying effects produced by such hydrocarbon resins and hydrocarbon elastomers, however, have not been too satisfactory. In particular, they are not applicable to strongly polar base polymers because of their poor compatibility. Moreover, they exhibit such low reactivity with base polymers as to reduce the mechanical strength, cohesion, adhesion, and rust-preventing capability of the base polymers after the curing of the coatings or adhesives or they migrate to the surface of the coatings or into the adhesive interface with the resultant discoloration and stickiness.
A few concrete examples are cited. In the preparation of corrosion-resistant lacquer compositions from polymers of acrylic acid or methacrylic acid or from copolymers of these acids with styrene, there have not been suitable substances which are reactive with these base polymers, function as plasticizers with good compatibility, and provide adhesion and rust prevention.
Two-pack epoxy or polyurethane coatings, adhesives, sealants, and caulking materials generate a large internal stress in the curing reaction and this disadvantageously reduces the adhesion, water resistance, and corrosion prevention of the cured coats or adhesive layers.
In the rubber industry, there has been a desire to apply a compound of natural rubber and a vinyl chloride resin to shoe soles and the like as a novel rubber having concurrently the elasticity of the former and the weathering resistance of the latter though the two constitute an incompatible system. Consequently, it has become necessary to find compatibilizers for such incompatible polymers. Known hydrocarbon resins, however tried, would not work as compatibilizers or tackifiers on account of their being compatible solely with the natural rubber phase.
In the automotive paints, there has arisen a need for improving the anti-corrosion performance of cationic electrodeposition coatings to be used for undercoats. The conventional hydrocarbon resins, however, are inert to cationic electrodeposition and are not applicable as anti-corrosion agents.
In the area of epoxy resin-based IC encapsulants, a large internal stress is generated during the curing of the encapsulants and this has caused a number of problems such as decreases in encapsulant-lead adhesion, water resistance, and reliabilty of the IC performance and formation of cracks. Hydrocarbon elastomers, for instance polybutene, have been applied to reduce the internal stress, but their poor compatibility with epoxy resins has produced such defects as staining of the molds during the molding operation, haze and turbidity on the surface of the molded articles, and bleeding to the surface.
Typical curing agents for epoxy resins are acid anhydrides, aromatic amines, and phenolic novolak resins. In particular, those epoxy resin molding materials which contain phenolic novolak curing agents have been used widely as encapsulants for IC and other semiconductor devices on account of their ease of molding, excellent moisture resistance, nontoxicity, and low cost.
A composition of epoxy resins and the resins obtained by polymerizing hydrocarbons such as styrene, indene, and alkylindenes and phenols in the presence of a Friedel-Crafts catalys
REFERENCES:
patent: 2865887 (1958-12-01), MacKenzie et al.
patent: 3644537 (1972-02-01), Dannels et al.
patent: 4471106 (1984-09-01), Luecke et al.
patent: 4491667 (1985-01-01), Saito et al.
patent: 5008350 (1991-04-01), Saito et al.
Nippon Steel Chemical Co. Ltd.
Sellers Robert E.
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