Polishing apparatus for finishing semiconductor wafer at high po

Details Polishing apparatus for finishing semiconductor wafer at high po Polishing apparatus for finishing semiconductor wafer at high po

1995-02-22

1998-05-12

Morgan, Eileen

Abrading

Abrading process

Glass or stone abrading

451 56, 451285, 451287, 451443, 451444, B24B 2900

Patent

active

057497710

ABSTRACT:
A polishing apparatus is equipped with a wafer holder and a pad conditioner concurrently changed to working position over a polishing pad, and the polishing pad grinds the semiconductor wafer under concurrent cleaning operation thereon so as to enhance the throughput of the polishing apparatus: grooves are formed in a wafer carrier of the wafer holder for sufficiently supplying polishing slurry to the semiconductor wafer, and a guide wall is provided over the polishing pad so as to cause the polishing slurry to partly return to a central area of the polishing pad.

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patent: 5032203 (1991-07-01), Doy et al.
patent: 5113622 (1992-05-01), Nishiguchi et al.
patent: 5216842 (1993-06-01), Breivogel et al.

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